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US Patent 10705578 Heat removal from memory modules

Patent 10705578 was granted and assigned to Hewlett Packard Enterprise on July, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Hewlett Packard Enterprise

Current Assignee

Hewlett Packard Enterprise

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10705578

Date of Patent

July 7, 2020

Patent Application Number

16191916

Date Filed

November 15, 2018

Patent Citations

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US Patent 10021814 Cooling apparatus for computer memory

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US Patent 10334757 Cooling methods for electronic components

Patent Citations Received

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US Patent 11805621 Memory auxiliary heat transfer structure

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US Patent 11246236 Liquid cooling jacket, liquid cooling system, and electronic device

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US Patent 11612084 Modular heatsink for vehicle computer cooling architecture

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US Patent 11687130 Heater apparatus-integrated peripheral component interconnect card for a computing device

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US Patent 10866621 Hinged dimm cooling device

Patent Primary Examiner

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Robert J Hoffberg

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