US Patent 11612084 Modular heatsink for vehicle computer cooling architecture

A thermal management system may cool at least a portion of a computer system with one or more cooling systems. The thermal management system can include one or more modular heatsink assemblies. The modular heatsink assemblies can include scalable heat spreader panels that are thermally coupled to a portion of the one or more cooling systems. The modular heatsink assembly can be positioned above and/or adjacent to a computer component, such as a dual in-line memory module. The scalable heat spreader panels are shaped to fit in between and to the sides of the computing component to draw heat away from the computing component.