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US Patent 10872820 Integrated circuit structures

Patent 10872820 was granted and assigned to Intel on December, 2020 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Applicant

Intel

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

108728200

Date of Patent

December 22, 2020

Patent Application Number

163163300

Date Filed

August 25, 2017

Patent Citations

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US Patent 10420171 Semiconductor devices on two sides of an isolation layer

Patent Citations Received

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US Patent 12136655 Backside electrical contacts to buried power rails

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US Patent 11869894 Metallization structures for stacked device connectivity and their methods of fabrication

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US Patent 12080713 Self-aligned etch in semiconductor devices

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US Patent 12132092 Backside vias in semiconductor device

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US Patent 11404548 Capacitance reduction for backside power rail device

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US Patent 11430814 Metallization structures for stacked device connectivity and their methods of fabrication

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US Patent 11869890 Stacked transistors with contact last

Patent Primary Examiner

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Ida M. Soward

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