Patent 10892236 was granted and assigned to Qualcomm on January, 2021 by the United States Patent and Trademark Office.
An integrated circuit, such as a flip chip, may be configured to increase the I/O cells by stacking the I/O cells in two or more rows with external high voltage circuits on opposite sides of a respective cell to reduce the distance between the rows. In addition, the integrated circuit may include a guard ring around the I/O cells to reduce signal noise interference generated by the external high voltage circuits in the I/O cells.