Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 9, 2021
Patent Application Number
16248533
Date Filed
January 15, 2019
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes a substrate, a first chip on the substrate, a second chip on the substrate and arranged side-by-side with the first chip, and a support structure on the second chip. A width of the support structure is equal to or greater than a width of the second chip.
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