US Patent 10916533 Semiconductor package
Patent 10916533 was granted and assigned to Samsung on February, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor package includes a substrate, a first chip on the substrate, a second chip on the substrate and arranged side-by-side with the first chip, and a support structure on the second chip. A width of the support structure is equal to or greater than a width of the second chip.
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Patent Number
109165330
Date of Patent
February 9, 2021
0Patent Application Number
162485330
Date Filed
January 15, 2019
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Patent Citations Received
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US Patent 10916533 Semiconductor package
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10916533
Date of patent
February 9, 2021
Patent application number
16248533
Date Filed
January 15, 2019
Patent primary examiner
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