US Patent 10922809 Method for detecting voids and an inspection system
All edits
Edits on 12 Dec, 2023
Golden AI
Edits made to:
Article (+439 characters)
Article
Patent abstract
A method for detecting voids in a metal line of a semiconductor device die includes: scanning an electron beam upon a selected location on the die containing the metal line; determine gray levels in an image produced by collected electrons of the electron beam backscattered from the selected location on the die; and identifying one or more voids in the metal line based on differences between the gray levels in the image.
Edits on 9 Oct, 2023
Golden AI
Edits made to:
Infobox (+3 properties)
Infobox
Patent Inventor Names
Dror Shemesh0
Nicolas L. Breil0
Vadim Kuchik0
Edits on 24 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 29 Apr, 2023
Golden AI
Infobox
Patent Citations Received
Edits on 2 Apr, 2023
Golden AI
Infobox
Patent Citations Received
Edits on 16 Nov, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 22 Sep, 2022
Golden AI
Infobox
Patent Citations Received
Edits on 3 Aug, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
Edits on 18 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 10 Feb, 2022
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 10922809 Method for detecting voids and an inspection system
Infobox
Is a
Patent jurisdiction
Patent number
10922809
Date of patent
February 16, 2021
Patent application number
16050412
Date Filed
July 31, 2018
Patent primary examiner
Find more entities like US Patent 10922809 Method for detecting voids and an inspection system
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
