Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 16, 2021
Patent Application Number
16297117
Date Filed
March 8, 2019
Patent Citations
Patent Primary Examiner
Patent abstract
A first conductive feature has a dielectric layer formed thereover. An opening is formed in the dielectric layer to expose a portion of the first conductive feature. A first barrier layer is formed over the first conductive feature and over a top surface of the dielectric layer. A second barrier layer is formed over the first barrier layer and on sidewalls of the opening. The second barrier layer is removed, resulting in at least a portion of the first barrier layer disposed over the first conductive feature. A second conductive feature is formed over the portion of the first barrier layer. Sidewalls of the second conductive feature directly contact the dielectric layer.
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