Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 16, 2021
Patent Application Number
16572084
Date Filed
September 16, 2019
Patent Citations Received
Patent Primary Examiner
Patent abstract
A conductive layer is formed between a metal gate structure, which includes a high-k gate dielectric layer and a gate electrode, and a contact feature. The conductive layer can be selectively deposited on a top surface of the gate electrode or, alternatively, non-selectively formed on the top surface of the gate electrode and the gate dielectric layer by controlling, for example, time of deposition. The conductive layer can have a bottom portion embedded into the gate electrode. The conductive layer and the contact feature can include the same composition, though they may be formed using different deposition techniques.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.