Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 23, 2021
Patent Application Number
16206724
Date Filed
November 30, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of manufacturing a semiconductor device comprises forming an integrated circuit, surrounding the integrated circuit with an inner seal ring, and surrounding the inner seal ring with a closed-loop outer seal ring. The inner seal ring includes a plurality of metal layers in a stacked configuration, first and second seal portions separated from each other, and third and fourth seal portions spaced apart from the first and second seal portions and separated from each other.
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