Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sanjay Dabral0
Long Huang0
Chi Nung Ni0
SivaChandra Jangam0
Date of Patent
January 2, 2024
0Patent Application Number
174608060
Date Filed
August 30, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
Chip sealing designs to accommodate die-to-die communication are described. In an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic seal structure.
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