Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Francis J. Carney0
Michael J. Seddon0
Date of Patent
March 16, 2021
0Patent Application Number
165451390
Date Filed
August 20, 2019
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A through-substrate vias structure includes a substrate having opposing first and second major surfaces. One or more conductive via structures are disposed extending from the first major surface to a first vertical distance within the substrate. A recessed region extends from the second major surface to a second vertical distance within the substrate and adjoining a lower surface of the conductive via. In one embodiment, the second vertical distance is greater than the first vertical distance. A conductive region is disposed within the recessed region and is configured to be in electrical and/or thermal communication with the conductive via.
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