Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bok Eng Cheah0
Choong Kooi Chee0
Jackson Chung Peng Kong0
Tat Hin Tan0
Wai Ling Lee0
Date of Patent
July 26, 2022
Patent Application Number
16451521
Date Filed
June 25, 2019
Patent Citations
Patent Primary Examiner
CPC Code
Disclosed embodiments include a multi-chip package that includes a stacked through-silicon via in a first semiconductive device, and the first semiconductive device is face-to-face coupled to a second semiconductive device by the stacked through-silicon via. The stacked through-silicon via includes a first portion that contacts a second portion, and the first portion emerges from an active semiconductive region of the first semiconductive device adjacent a keep-out region.
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