Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 23, 2021
Patent Application Number
16344640
Date Filed
October 25, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A cooling package in a power module comprises a first side for placing one or more semiconductor components; one or more holes for placing one or more magnetic components; and a second side with one or more connection parts. Therefore, all components of a power module which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.
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