US Patent 10959319 Cooling package and power module
All edits
Edits on 12 Dec, 2023
Golden AI
Edits made to:
Article (+413 characters)
Article
Patent abstract
A cooling package in a power module comprises a first side for placing one or more semiconductor components; one or more holes for placing one or more magnetic components; and a second side with one or more connection parts. Therefore, all components of a power module which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.
Edits on 7 Sep, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 24 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 26 Mar, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
109593190
Date of Patent
March 23, 2021
0Patent Application Number
163446400
Date Filed
October 25, 2016
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
109593190
Date of Patent
March 23, 2021
0Patent Application Number
163446400
Date Filed
October 25, 2016
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 10 Feb, 2022
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 10959319 Cooling package and power module
Infobox
Is a
Patent jurisdiction
Patent number
10959319
Date of patent
March 23, 2021
Patent application number
16344640
Date Filed
October 25, 2016
Patent primary examiner
Find more entities like US Patent 10959319 Cooling package and power module
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
