US Patent 10964560 Substrate chuck and substrate bonding system including the same
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Patent abstract
Provided are a substrate chuck and a substrate bonding system including the substrate chuck. The substrate bonding system includes a lower substrate chuck and an upper substrate chuck disposed on the lower substrate chuck. The lower substrate chuck has a non-flat lower substrate contact surface, and the upper substrate chuck has a flat upper substrate contact surface.
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Patent Inventor Names
Heebok Kang0
Youngbin Choi0
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Official Website
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US Patent 10964560 Substrate chuck and substrate bonding system including the same
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Is a
Patent applicant
Patent jurisdiction
Patent number
10964560
Date of patent
March 30, 2021
Patent application number
15203486
Date Filed
July 6, 2016
Patent primary examiner
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