US Patent 10978409 Semiconductor package
Patent 10978409 was granted and assigned to Samsung on April, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 23, 2018
Date of Patent
April 13, 2021
Patent Applicant
Patent Application Number
16109766
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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