Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 4, 2023
0Patent Application Number
173928680
Date Filed
August 3, 2021
0Patent Citations
...
Patent Primary Examiner
A chip package structure is provided. The chip package structure includes a substrate. The chip package structure also includes a first chip structure and a second chip structure over the substrate. The chip package structure further includes an anti-warpage bar over a first portion of the first chip structure and over a second portion of the second chip structure. A width of the anti-warpage bar overlapping the second portion of the second chip structure is greater than a width of the anti-warpage bar overlapping the first portion of the first chip structure.
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