Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 20, 2021
Patent Application Number
16378584
Date Filed
April 9, 2019
Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for fabricating semiconductor device includes: forming a first semiconductor layer and an insulating layer on a substrate; removing the insulating layer and the first semiconductor layer to form openings; forming a second semiconductor layer in the openings; and patterning the second semiconductor layer, the insulating layer, and the first semiconductor layer to form fin-shaped structures.
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