US Patent 10991667 Isolation structure for bond pad structure
Is a
Date Filed
August 6, 2019
0
Date of Patent
April 27, 2021
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Patent Application Number
16532781
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Patent Citations
Patent Inventor Names
Sin-Yao Huang
0
Jeng-Shyan Lin
0
Shih-Pei Chou
0
Tzu-Hsuan Hsu
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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