US Patent 10992272 High-frequency module with connection interface

A high-frequency module can be used in communication satellites. The high-frequency module contains an electronic unit and a housing. The housing at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing. An internal connector is arranged on the housing, which is coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector. The internal connector is constructed integrally with at least a part of the housing. This allows a thermo-mechanical stress on the electronic unit to be reduced.