Patent attributes
A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.
