Patent attributes
An integrated fan-out (InFO) package includes a first redistribution structure, a die, an encapsulant, a plurality of through insulating vias (TIV), a plurality of dipole antennas, and a second redistribution structure. The die is disposed on the first redistribution structure. The encapsulant encapsulates the die. The TIVs and the dipole antennas are embedded in the encapsulant. Each dipole antenna includes a pair of antenna elements. Each antenna element has a first folded-sidewall and a second folded-sidewall opposite to the first folded-sidewall. A portion of each second folded-sidewall in the pair of antenna elements face each other. Each first folded-sidewall includes at least three sub-sidewalls connected to each other. The adjacent sub-sidewalls form an obtuse angle. The second redistribution structure is disposed on the die, the TIVs, the dipole antennas, and the encapsulant.
