Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 31, 2023
Patent Application Number
17205055
Date Filed
March 18, 2021
Patent Citations
Patent Primary Examiner
A semiconductor package includes a redistribution wiring layer having redistribution wirings, a semiconductor chip on the redistribution wiring layer, a frame on the redistribution wiring layer, the frame surrounding the semiconductor chip, and the frame having core connection wirings electrically connected to the redistribution wirings, and an antenna structure on the frame, the antenna structure including a ground pattern layer, a first antenna insulation layer, a radiator pattern layer, a second antenna insulation layer, and a director pattern layer sequentially stacked on one another.
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