US Patent 11018000 Electronic apparatus and manufacturing method of the same

According to one embodiment, an electronic apparatus including a first substrate comprising a first conductive layer; a second substrate which is opposed to the first conductive layer and is separated from the first conductive layer, the second substrate including: a second conductive layer, and a first hole penetrating the second substrate; and a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole, wherein the second conductive layer is located on the second substrate on a side opposite to a side that is opposed to the first conductive layer.