US Patent 11024596 Bonding apparatus and bonding method

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

11024596

Date of Patent

June 1, 2021

Patent Application Number

16464300

Date Filed

November 29, 2017

Patent Citations

‌

US Patent 10872875 Bonding head and method for bonding semiconductor package, and semiconductor package

Patent Citations Received

‌

US Patent 11961817 Apparatus and method for forming a package structure

‌

US Patent 11373975 Electronic component mounting device

‌

US Patent 11521950 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Patent Primary Examiner

‌

David A Zarneke

Patent abstract

[Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 11024596 Bonding apparatus and bonding method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API