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US Patent 11373975 Electronic component mounting device

Overview Structured Data Issues Contributors Activity

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Kohei Seyama0

Date of Patent

June 28, 2022

Patent Application Number

16496456

Date Filed

March 28, 2017

Patent Citations

US Patent 11024596 Bonding apparatus and bonding method

US Patent 10872875 Bonding head and method for bonding semiconductor package, and semiconductor package

Patent Citations Received

US Patent 11521950 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

US Patent 11961817 Apparatus and method for forming a package structure

0

Patent Primary Examiner

Michael M Trinh

CPC Code

H01L 2224/83203

H01L 2224/83191

H01L 2224/83862

H01L 2224/81203

H01L 2224/81191

...

An electronic component mounting device (

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