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US Patent 11024611 Micro-LED array transfer method, manufacturing method and display device

Patent 11024611 was granted and assigned to GoerTek on June, 2021 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12074145 Method for manufacturing an optoelectronic light emitting device
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Edits on 12 Dec, 2023
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Patent abstract

A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.

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Patent Inventor Names
Peixuan Chen0
Quanbo Zou0
Tao Gan0
Xiangxu Feng0
Xiaoyang Zhang0
Zhe Wang0
Edits on 26 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110246110
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Infobox
Is a
Patent
Patent
0
Patent Applicant
GoerTek
GoerTek
0
Current Assignee
GoerTek
GoerTek
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
110246110
Date of Patent
June 1, 2021
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Patent Application Number
166202240
Date Filed
June 9, 2017
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110246110
Patent Citations
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US Patent 10319697 Transferring method, manufacturing method, device and electronic apparatus of micro-LED
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US Patent 10964867 Using underfill or flux to promote placing and parallel bonding of light emitting diodes
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Patent Primary Examiner
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Jarrett J Stark
0
Edits on 3 Apr, 2023
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=11024611
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 US Patent 11024611 Micro-LED array transfer method, manufacturing method and display device

Infobox
Is a
Patent
Patent
Patent applicant
GoerTek
GoerTek
Current assignee
GoerTek
GoerTek
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11024611
Date of patent
June 1, 2021
Patent application number
16620224
Date Filed
June 9, 2017
Patent citations
‌
US Patent 10319697 Transferring method, manufacturing method, device and electronic apparatus of micro-LED
‌
US Patent 10964867 Using underfill or flux to promote placing and parallel bonding of light emitting diodes
Patent primary examiner
‌
Jarrett J Stark

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