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US Patent 11037860 Multi layer thermal interface material

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Patent Citations Received
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US Patent 11942453 Thermal management of three-dimensional integrated circuits
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Patent abstract

A multi-layer thermal interface material including two or more thermal interface materials laminated together, where each of the two or more thermal interface materials comprise different mechanical properties.

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Patent Inventor Names
Eric J. Campbell0
Mark K. Hoffmeyer0
Phillip V. Mann0
Sarah K. Czaplewski-Campbell0
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US Patent 11710723 Thermal management of three-dimensional integrated circuits
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110378600
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=11037860
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 US Patent 11037860 Multi layer thermal interface material

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11037860
Date of patent
June 15, 2021
Patent application number
16454370
Date Filed
June 27, 2019
Patent citations
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US Patent 10182514 Thermal interface material structures
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US Patent 10186477 Power overlay structure and method of making same
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US Patent 10566313 Integrated circuit chip carrier with in-plane thermal conductance layer
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US Patent 10781349 Thermal interface material including crosslinker and multiple fillers
Patent primary examiner
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Ida M. Soward

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