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US Patent 11043532 Semiconductor device

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Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Takashi Yokoyama0

Taku Umebayashi0

Date of Patent

June 22, 2021

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Patent Application Number

164772620

Date Filed

December 13, 2017

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Patent Citations

US Patent 10600763 Multi-deck three-dimensional memory devices and methods for forming the same

US Patent 10497708 Memory structure and forming method thereof

US Patent 10636813 Three-dimensional memory devices having transferred interconnect layer and methods for forming the same

US Patent 10229942 Solid state imaging device and electronic apparatus

US Patent 10283493 Three-dimensional memory device containing bonded memory die and peripheral logic die and method of making thereof

Patent Citations Received

US Patent 11444069 3D semiconductor package including memory array

Patent Primary Examiner

Leon Viet Q Nguyen

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Patent abstract

A semiconductor device according to an embodiment of the present technology, and the semiconductor device includes: a first substrate provided with a memory array; and a second substrate that is stacked with the first substrate, and is provided with a peripheral circuit that controls operation of the memory array.

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