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US Patent 11064279 Headphone earcup including seamless cover

Patent 11064279 was granted and assigned to Microsoft on July, 2021 by the United States Patent and Trademark Office.

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Patent abstract

A headphone device having an earcup that is configured to form a portion of an acoustic assembly of a headphone device. The earcup includes a seamless three-dimensional cover. The cover is formed from a continuous fabric of interlocking yarn. The cover can include portions having different performance characteristics, such as acoustic properties and/or comfort properties, that can be provided using different knit patterns and/or different fabric materials.

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