US Patent 11064279 Headphone earcup including seamless cover
Patent 11064279 was granted and assigned to Microsoft on July, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A headphone device having an earcup that is configured to form a portion of an acoustic assembly of a headphone device. The earcup includes a seamless three-dimensional cover. The cover is formed from a continuous fabric of interlocking yarn. The cover can include portions having different performance characteristics, such as acoustic properties and/or comfort properties, that can be provided using different knit patterns and/or different fabric materials.
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Patent Inventor Names
Kelly M. Bogan0
Paul Ryan Sandoval0
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Official Website
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
110642790
Date of Patent
July 13, 2021
0Patent Application Number
165978070
Date Filed
October 9, 2019
0Official Website
Patent Citations
Patent Primary Examiner
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US Patent 11064279 Headphone earcup including seamless cover
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11064279
Date of patent
July 13, 2021
Patent application number
16597807
Date Filed
October 9, 2019
Patent citations
Patent primary examiner
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