US Patent 11114433 3DIC structure and method of fabricating the same
Patent 11114433 was granted and assigned to Taiwan Semiconductor Manufacturing Company on September, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 15, 2018
0
Date of Patent
September 7, 2021
0
Patent Application Number
20180715
0
Patent Citations Received
Patent Inventor Names
Hsien-Wei Chen
0
Ming-Fa Chen
0
Patent Jurisdiction
Patent Number
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