Patent attributes
A power delivery module includes a frame having rails defining an opening that receives an electronic package. A bottom of the frame is mounted to a host circuit board and faces an upper surface of the electronic package. The frame is a layered structure including a power plate, a ground plate, and an insulator electrically isolating the power plate from the ground plate. The power deliver module includes module power contacts electrically connected to the power plate and extending from the bottom for electrical connection to package power contacts of the electronic package. Module ground contacts are electrically connected to the ground plate and extend from the bottom for electrical connection to package ground contacts of the electronic package. The module power contacts and the module ground contacts deliver power to the electronic package.
