Patent attributes
An optoelectronic assembly includes an optical module assembly including a fiber optic connector and an optical engine on an optical engine substrate. The fiber optic connector has a ferrule holding optical fibers optically coupled to the optical engine. The optical engine substrate includes a contact array of optical engine contacts at a bottom of the optical engine substrate. The optical module assembly includes a heat transfer element thermally coupled to the optical engine. The optical module assembly includes a backshell configured to be coupled to a circuit board. The backshell holds the heat transfer element in thermal contact with the optical engine. The optoelectronic assembly includes an interposer assembly electrically connected to the contact array of optical engine contacts having compressible interposer contacts with separable mating interfaces.