Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
September 28, 2021
Patent Application Number
20190920
Date Filed
September 20, 2019
Patent Citations Received
Patent abstract
Methods for filling a substrate feature with a seamless dielectric gap fill are described. Methods comprise sequentially depositing a film with a seam, etching the the film to form a recess, and depositing a second film in the recess to form a seamless gap fill.
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