US Patent 11133178 Seamless gapfill with dielectric ALD films
Patent 11133178 was granted and assigned to Applied Materials on September, 2021 by the United States Patent and Trademark Office.
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Patent abstract
Methods for filling a substrate feature with a seamless dielectric gap fill are described. Methods comprise sequentially depositing a film with a seam, etching the the film to form a recess, and depositing a second film in the recess to form a seamless gap fill.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111331780
Date of Patent
September 28, 2021
0Patent Application Number
201909200
Date Filed
September 20, 2019
0Official Website
Edits on 26 Sep, 2022
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111331780
Date of Patent
September 28, 2021
0Patent Application Number
201909200
Date Filed
September 20, 2019
0Official Website
Edits on 6 Jun, 2022
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Edits on 30 Sep, 2021
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US Patent 11133178 Seamless gapfill with dielectric ALD films
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11133178
Date of patent
September 28, 2021
Patent application number
20190920
Date Filed
September 20, 2019
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