US Patent 11146894 Packaging for a MEMS transducer
Patent 11146894 was granted and assigned to Cirrus Logic on October, 2021 by the United States Patent and Trademark Office.
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Patent abstract
The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.
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Patent Citations Received
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Patent Inventor Names
Rkia Achehboune0
Roberto Brioschi0
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Official Website
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Patent Applicant
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Patent Jurisdiction
Patent Number
111468940
Date of Patent
October 12, 2021
0Patent Application Number
202003190
Date Filed
March 19, 2020
0Official Website
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US Patent 11146894 Packaging for a MEMS transducer
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11146894
Date of patent
October 12, 2021
Patent application number
20200319
Date Filed
March 19, 2020
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