Patent 11171220 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2021 by the United States Patent and Trademark Office.
A method of forming a gate dielectric material includes forming a high-K dielectric material in a first region over a substrate, where forming the high-K dielectric material includes forming a first dielectric layer comprising hafnium over the substrate, and forming a second dielectric layer comprising lanthanum over the first dielectric layer.