Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 9, 2021
Patent Application Number
20200225
Date Filed
February 25, 2020
Patent Primary Examiner
Patent abstract
A method of manufacturing an LED assembly is described. The method includes providing an LED package comprising one or more LEDs arranged in a support body and thermal and electrical contact regions on one or more surfaces of the support body. The method further includes providing a heatpipe and forming a thermal contact between a contact region of the LED package and a first end region of the heatpipe. An LED package, an LED assembly, and an LED lighting arrangement are also described.
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