US Patent 11171275 Method of manufacturing an LED assembly
Patent 11171275 was granted and assigned to Lumileds on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A method of manufacturing an LED assembly is described. The method includes providing an LED package comprising one or more LEDs arranged in a support body and thermal and electrical contact regions on one or more surfaces of the support body. The method further includes providing a heatpipe and forming a thermal contact between a contact region of the LED package and a first end region of the heatpipe. An LED package, an LED assembly, and an LED lighting arrangement are also described.
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111712750
Date of Patent
November 9, 2021
0Patent Application Number
202002250
Date Filed
February 25, 2020
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111712750
Date of Patent
November 9, 2021
0Patent Application Number
202002250
Date Filed
February 25, 2020
0Official Website
Patent Primary Examiner
Edits on 7 Jun, 2022
Golden AI
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Edits on 11 Nov, 2021
Golden AI
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US Patent 11171275 Method of manufacturing an LED assembly
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11171275
Date of patent
November 9, 2021
Patent application number
20200225
Date Filed
February 25, 2020
Patent primary examiner
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