The present invention discloses a microphone module. The module comprises: a housing having a sound receiving hole; a pressing plate fixedly combined with the housing, an accommodating cavity being formed between the inner side surface of the pressing plate and the outer side surface of the housing, and the pressing plate comprising sound transmitting hole corresponding to the sound receiving hole; and an intermediate layer covering the sound receiving hole, provided on the outer or inner side surface of the housing, and corresponding to the sound receiving hole. The housing further comprises an annular protrusion having a passage, extending outwards from the outer side surface of the housing, and surrounding the sound receiving hole. According to the microphone module provided in the present invention, by combining the sound transmitting hole with the annular protrusion having the passage, the vibration amplitude of the intermediate layer remains small even when the microphone module is subjected to high-pressure water impact, such that deformation and breaking of the intermediate layer are avoided. Therefore, the influence on the acoustic performance and waterproof performance of the microphone module is reduced.
US Patent 11178476 Microphone module
Patent 11178476 was granted and assigned to GoerTek on November, 2021 by the United States Patent and Trademark Office.
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