US Patent 11186909 Methods of depositing low-K films
Patent 11186909 was granted and assigned to Applied Materials on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
Methods for atomic layer deposition (ALD) of plasma enhanced atomic layer deposition (PEALD) of low-κ films are described. A method of depositing a film comprises exposing a substrate to a silicon precursor having the general formula (I) or general formula (II)
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Patent Inventor Names
Bhaskar Jyoti Bhuyan0
Mark Saly0
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Official Website
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US Patent 11186909 Methods of depositing low-K films
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Patent applicant
Current assignee
Patent jurisdiction
Patent number
11186909
Date of patent
November 30, 2021
Patent application number
16550486
Date Filed
August 26, 2019
Patent primary examiner
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