Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroto Tsuruo0
Date of Patent
November 30, 2021
0Patent Application Number
165312270
Date Filed
August 5, 2019
0Patent Primary Examiner
Patent abstract
A sensor device that can suppress deformation of a holder due to a molding pressure applied during injection molding of a housing is provided. A second magnetism collection portion holder has a suppression portion that projects from a second holder body portion toward a first holder and that suppresses deformation of the holder due to the molding pressure applied during the injection molding. The distal end surface of the suppression portion abuts against the inner surface of a first holder body portion with the first holder and a second holder assembled to each other with a sensor unit interposed therebetween.
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