US Patent 11187601 Sensor device
Patent 11187601 was granted and assigned to JTEKT on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A sensor device that can suppress deformation of a holder due to a molding pressure applied during injection molding of a housing is provided. A second magnetism collection portion holder has a suppression portion that projects from a second holder body portion toward a first holder and that suppresses deformation of the holder due to the molding pressure applied during the injection molding. The distal end surface of the suppression portion abuts against the inner surface of a first holder body portion with the first holder and a second holder assembled to each other with a sensor unit interposed therebetween.
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Patent Inventor Names
Hiroto Tsuruo0
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Official Website
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111876010
Date of Patent
November 30, 2021
0Patent Application Number
165312270
Date Filed
August 5, 2019
0Official Website
Patent Primary Examiner
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US Patent 11187601 Sensor device
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11187601
Date of patent
November 30, 2021
Patent application number
16531227
Date Filed
August 5, 2019
Patent primary examiner
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