Patent 11189613 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2021 by the United States Patent and Trademark Office.
A semiconductor device and a method of forming the same are provided. The semiconductor device includes a transistor and a diode. The transistor includes a first gate region electrically coupled to a gate driver, and a first source region and a first drain region on two sides of the first gate region. The diode includes two terminals coupled between the first drain region of the transistor and a reference voltage. The transistor has a threshold voltage greater than that of the diode.