US Patent 11233035 Package structure and method of manufacturing the same
Patent 11233035 was granted and assigned to Taiwan Semiconductor Manufacturing Company on January, 2022 by the United States Patent and Trademark Office.
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Patent abstract
A package structure includes a first die, a die stack structure, a support structure and an insulation structure. The die stack structure is bonded to the first die. The support structure is disposed on the die stack structure. A width of the support structure is larger than a width of the die stack structure and less than a width of the first die. The insulation structure at least laterally wraps around the die stack structure and the support structure.
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Patent Number
112330350
Date of Patent
January 25, 2022
0Patent Application Number
168867220
Date Filed
May 28, 2020
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
112330350
Date of Patent
January 25, 2022
0Patent Application Number
168867220
Date Filed
May 28, 2020
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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US Patent 11233035 Package structure and method of manufacturing the same
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
11233035
Date of patent
January 25, 2022
Patent application number
16886722
Date Filed
May 28, 2020
Patent primary examiner
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