US Patent 11233035 Package structure and method of manufacturing the same
Patent 11233035 was granted and assigned to Taiwan Semiconductor Manufacturing Company on January, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 28, 2020
Date of Patent
January 25, 2022
Patent Application Number
16886722
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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