US Patent 11237473 Physical vapor deposition system and processes
Patent 11237473 was granted and assigned to Applied Materials on February, 2022 by the United States Patent and Trademark Office.
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Patent abstract
A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets. A process for improving reflectivity from a multilayer stack is also disclosed.
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Patent Inventor Names
Sanjay Bhat0
Vibhu Jindal0
Wen Xiao0
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Patent Number
112374730
Date of Patent
February 1, 2022
0Patent Application Number
168016420
Date Filed
February 26, 2020
0Official Website
Patent Citations
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US Patent 11237473 Physical vapor deposition system and processes
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11237473
Date of patent
February 1, 2022
Patent application number
16801642
Date Filed
February 26, 2020
Patent citations
Patent primary examiner
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