Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 8, 2022
Patent Application Number
16746976
Date Filed
January 20, 2020
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package including a first semiconductor device, a second semiconductor device, an insulating encapsulant, a redistribution structure and a supporting element is provided. The insulating encapsulant encapsulates the first semiconductor device and the second semiconductor device. The redistribution structure is over the first semiconductor device, the second semiconductor device and the insulating encapsulant. The redistribution structure is electrically connected to the first semiconductor device and the second semiconductor device. The supporting element is embedded in one of the insulating encapsulant and the redistribution structure.
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